Temperature increase within quantum-cascade lasers originating from their incomplete soldering
AbstractThermal and electrical properties of the semiconductor quantum-cascade laser are investigated with the aid of an finite-element numerical model. Optimal parameters of the solder and contact layers have been determined. A dramatic impact on the heat-flux generation and spreading within the volume of the laser with an incomplete soldering of the bottom surface of the laser chip has been expected. Therefore in this case, temperature increases at the front mirror are much higher than those in places far from the area of incomplete chip soldering. Moreover, measurements of temperature increases in the mirror plane are not giving adequate information about temperature distributions within an ample internal laser part.
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- Ł. Olejniczak, R. P. Sarzała, and W. Nakwaski, "Comparative analysis of thermal properties of various quantum-cascade lasers",10th Intern. Conf. Transparent Optical Networks (ICTON 2008), Athens (Greece) June 22-26, 2008, Proceedings 2, 271 (2008)
- K. Pierściński, Intern. Conf. Semicond. Mid-IR Materials and Optics (SMMO 2010), Warsaw, Oct. 21-23, 2010
- K. Kosiel et al., Phot. Lett. Poland 1, 16 (2009)
How to Cite
R. P. Sarzała, M. Wasiak, and W. Nakwaski, “Temperature increase within quantum-cascade lasers originating from their incomplete soldering”, Photonics Lett. Pol., vol. 3, no. 2, pp. pp. 52–54, Jun. 2011.