Laser manufacturing of microsieves for bioengineering applications

Mariusz Łapiński, Zdzisław Bogdanowicz, Jan Marczak, Antoni Rycyk, Antoni Sarzyński, Marek Strzelec

Abstract


Laser drilling is a noncontact technology which allows high flexibility and full automation of the process. The research presented aimed at developing laser technology for manufacturing microsieves in thin Ni and Al foils. Involute and square distributions of holes were formed with an overall dimension of 3mm. Distance between adjacent holes was 25um to 100um, which meant fabrication of up to 10,000 openings per microsieve. Owing to optimisation of the optical system design and laser micromachining system parameters, holes with a desired diameter of around 12um were fabricated, limited only by diffraction divergence of laser beam.

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References
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Photonics Letters of Poland - A Publication of the Photonics Society of Poland
Published in cooperation with SPIE

ISSN: 2080-2242